1715480

Board level reliability of three-dimensional systems in package (SIPs)

Sugiyama, Takuya ; Yano, Yuji ; Ishihara, Sayaka ; Maruyama, Tomoyo ; Juso, Hiroynki ; Kirnura, T. ; Kada, Morihiro

SHARP Corporation

2003

1106

1111

Application specific integrated circuits; Cameras; Cities and towns; Costs; Integrated circuit packaging; Logic; Mobile handsets; Stacking; Testing; Thermal stresses;

English

ieee

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

0569-5503

0-7803-7791-5

conf

10.1109/ECTC.2003.1216429

1216429