Title :
A novel technology for stacking microvias on printed wiring board
Author :
Liu, Fuhan ; White, George E. ; Sundaram, Venky ; Aggarwal, Ankur O. ; Hosseini, Seyed M. ; Sutter, Dean ; Tummala, Rao R.
Author_Institution :
Georgia Institute of Technology
Keywords :
Copper; Flip chip; Integrated circuit interconnections; Nonhomogeneous media; Packaging; Partial response channels; Planarization; Space technology; Stacking; Wiring;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216434
