Title :
Prediction of moisture induced failures in flip chip on flex interconnections with non-conductive adhesives
Author :
Caers, J.F.J.M. ; Zhao, X.J. ; Wong, E.H. ; Ong, C.K. ; Wu, Z.X. ; Ranjan, R.
Author_Institution :
Philips Electronics Singapore
Keywords :
Aging; Assembly; Contact resistance; Curing; Flip chip; Moisture; Nonconductive adhesives; Stress; Temperature; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216441
