Title :
RF PA module substrate via reliability
Author :
Darveaux, Robert ; Yang, Jicheng ; Sheridan, Richard ; Buella, Boy ; Villareal, Paul
Author_Institution :
Amkor Technology, Inc.
Keywords :
Copper; Electrical resistance measurement; Immune system; Laminates; Modular construction; Packaging; Printed circuits; Radio frequency; Temperature measurement; Thermal stresses;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216442
