• DocumentCode
    1715867
  • Title

    Comparison of interfacial reactions and reliabilifies of Sn3.5Ag, Sn4.0Ag0.5Cu, and Sn0.7Cu solder bumps on electroless Ni-P UBMs

  • Author

    Jeon, Young-Doo ; Ostmann, Adreas ; Reichl, Herbert ; Paik, Kyung-Wook

  • Author_Institution
    Korea Advanced Institute of Science and Technology
  • fYear
    2003
  • Firstpage
    1203
  • Lastpage
    1208
  • Keywords
    Aging; Costs; Flip chip; Materials reliability; Materials science and technology; Reliability engineering; Soldering; Temperature; Testing; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216445
  • Filename
    1216445
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1715867