DocumentCode :
1715872
Title :
Investigation of electroplating Ni UBM for Pb-free solders
Author :
Chang, Shu-Ming ; Uang, Ruoh-Huey ; Liou, Dau-Chi ; Hu, Hsu-Tien ; Chen, Kuo-Chuan ; Chen, Yu-Fang ; Chen, Yu-Hua
Author_Institution :
APC/ERSO/ITRI
fYear :
2003
Firstpage :
1209
Lastpage :
1214
Keywords :
Adhesives; Conductivity; Electronics packaging; Environmentally friendly manufacturing techniques; Flip chip; Lead; Scanning electron microscopy; Stress; Transistors; Transmission electron microscopy;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN :
0569-5503
Print_ISBN :
0-7803-7791-5
Type :
conf
DOI :
10.1109/ECTC.2003.1216446
Filename :
1216446
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1715872
