Title :
UBM integrity studies on copper/low-k dielectrics for fine pitch flip chip packaging
Author :
Yoon, Seung Wook ; Kripesh, Vaidyanathan ; Kwan, Wong Wai ; Yong, Li Chao ; Tong, Chen Xian ; Dong, Gui ; Rasiah, Ignatius J. ; Iyer, Mahadevan K.
Author_Institution :
Institute of Microelectronics
Keywords :
Aluminum; Chemical technology; Copper; Dielectric materials; Failure analysis; Flip chip; Integrated circuit interconnections; Integrated circuit packaging; Metallization; Optical microscopy;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216448
