Title :
Broadband characterization of package dielectrics
Author :
Braunisch, Henning ; Han, Dong-Ho
Author_Institution :
Intel Corporation
Keywords :
Dielectric constant; Dielectric losses; Dielectric materials; Dielectric measurements; Dielectric substrates; Frequency; Materials testing; Microprocessors; Packaging machines; Scattering parameters;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216454
