DocumentCode
1716081
Title
Broadband characterization of package dielectrics
Author
Braunisch, Henning ; Han, Dong-Ho
Author_Institution
Intel Corporation
fYear
2003
Firstpage
1258
Lastpage
1263
Keywords
Dielectric constant; Dielectric losses; Dielectric materials; Dielectric measurements; Dielectric substrates; Frequency; Materials testing; Microprocessors; Packaging machines; Scattering parameters;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216454
Filename
1216454
Link To Document