Title :
Electrical modeling and characterization of packaging solutions utilizing lead-free second level interconnects
Author :
O´Connor, Daniel P. ; Hamel, Harvey ; Spring, Christopher ; Audet, Jean
Author_Institution :
IBM Corporation
Keywords :
Ceramics; Environmentally friendly manufacturing techniques; Geometry; Hardware; Leg; Packaging; Power distribution; Power system interconnection; Springs; Voltage;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216456
