Title :
Integrated microfluidic cooling of high power passive and active devices on multilayer organic substrate
Author :
Chlieh, Outmane Lemtiri ; Khan, Wasif T. ; Papapolymerou, John
Author_Institution :
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Abstract :
This paper presents a microfluidic cooling solution for passive and active devices on liquid crystal polymer (LCP). Distilled (DI) water circulates inside a 15 mil micromachined channel and takes away the dissipated heat from passive and active heat sources. A micropump is used to provide enough pressure to inject the fluid and to ensure its circulation. A 20 W surface mount resistor is cooled with moving DI water and operated at 12.3 W at 25 °C, while this device can only dissipate 7 W at 25 °C if the DI water is static. A 5 W discrete power gallium arsenide (GaAs) die is attached to the microfluidic channel and cooled to operate at 3.45 W at 60 °C under DC operation.
Keywords :
III-V semiconductors; cooling; gallium arsenide; liquid crystal polymers; microfluidics; micropumps; resistors; surface mount technology; DC operation; DI water; LCP; active heat source; discrete power gallium arsenide die; dissipated heat; distilled water; high-power active device; high-power passive device; integrated microfluidic cooling; liquid crystal polymer; microfluidic channel; microfluidic cooling solution; micromachined channel; micropump; multilayer organic substrate; passive heat source; power 12.3 W; power 20 W; power 3.45 W; power 5 W; surface mount resistor; temperature 25 degC; temperature 60 degC; Abstracts; Educational institutions; Heating; Imaging; Indexes; PHEMTs; Polymers; distilled (DI) water; gallium arsenide (GaAs); heat sink; high power; liquid crystal polymer (LCP); microchannel; microfluidic; surface mount resistor;
Conference_Titel :
Microwave Symposium (IMS), 2014 IEEE MTT-S International
Conference_Location :
Tampa, FL
DOI :
10.1109/MWSYM.2014.6848611
