Title :
Automated assembly and packaging of hybrid optical modules
Author :
Madsen, Henrik ; Shiv, Lior ; Eiger, G. ; Hase, Andreas ; Heschel, Matthias ; Kulunann, J.
Author_Institution :
Hymite GmbH
Keywords :
Assembly; Costs; Encapsulation; Integrated optics; Optical devices; Optical interconnections; Packaging; Soldering; Telecommunications; Thermal management;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216461
