Title :
Novel method of separating probe and wire bond regions without increasing die size
Author :
Yong, Lois ; Tran, Tu Anh ; Lee, Stephen ; Williams, Bill ; Ross, Jody
Author_Institution :
Motorola Semiconductor Products Sector
Keywords :
Aluminum; CMOS technology; Copper; Packaging; Probes; Silicon; Testing; Wafer bonding; Wafer scale integration; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216466
