Title :
Measurement uncertainty characterization of terahertz large wafer probing
Author :
Qiang Yu ; Bauwens, M. ; Lichtenberger, Arthur W. ; Weikle, Robert M. ; Barker, N.S.
Author_Institution :
Charles L. Brown Dept. of Electr. & Comput. Eng., Univ. of Virginia, Charlottesville, VA, USA
Abstract :
This paper introduces the characterization of the measurement uncertainty of large wafer probing in the WR-1.5 (500 GHz - 750 GHz) band. A micromachined WR-1.5 probe with integrated strain sensor is used to measure calibration standard sets at different locations on a 2-inch wafer. Measurement results of the strain sensor assisted WR-1.5 probe using 20 mN contract force are presented. As a comparison, measurement results of the WR-1.5 probe using fixed z-travel and corrected z-travel by z-profiling function provided by the probe station are also presented. Factors that contribute to measurement uncertainty are discussed. In addition, the recommended procedure for terahertz probing without an integrated strain sensor is provided.
Keywords :
calibration; measurement uncertainty; micromachining; microsensors; strain measurement; strain sensors; submillimetre wave detectors; submillimetre wave measurement; calibration standard set; contract force; frequency 500 GHz to 750 GHz; integrated strain sensor; measurement uncertainty estimation; micromachined WR-1.5 probe; probe station; size 2 inch; terahertz large wafer probing; z-profiling function; z-travel; Apertures; Contracts; Q measurement; Reliability; Sensors; Standards; Calibration; measurement uncertainty; probes; sensor control; sensors; submillimeter-wave measurements;
Conference_Titel :
Microwave Symposium (IMS), 2014 IEEE MTT-S International
Conference_Location :
Tampa, FL
DOI :
10.1109/MWSYM.2014.6848623
