Measurement uncertainty characterization of terahertz large wafer probing

Author

Qiang Yu ; Bauwens, M. ; Lichtenberger, Arthur W. ; Weikle, Robert M. ; Barker, N.S.

Author_Institution

Charles L. Brown Dept. of Electr. & Comput. Eng., Univ. of Virginia, Charlottesville, VA, USA

fYear

2014

fDate

1-6 June 2014

Firstpage

1

Lastpage

4

Abstract

This paper introduces the characterization of the measurement uncertainty of large wafer probing in the WR-1.5 (500 GHz - 750 GHz) band. A micromachined WR-1.5 probe with integrated strain sensor is used to measure calibration standard sets at different locations on a 2-inch wafer. Measurement results of the strain sensor assisted WR-1.5 probe using 20 mN contract force are presented. As a comparison, measurement results of the WR-1.5 probe using fixed z-travel and corrected z-travel by z-profiling function provided by the probe station are also presented. Factors that contribute to measurement uncertainty are discussed. In addition, the recommended procedure for terahertz probing without an integrated strain sensor is provided.

Keywords

calibration; measurement uncertainty; micromachining; microsensors; strain measurement; strain sensors; submillimetre wave detectors; submillimetre wave measurement; calibration standard set; contract force; frequency 500 GHz to 750 GHz; integrated strain sensor; measurement uncertainty estimation; micromachined WR-1.5 probe; probe station; size 2 inch; terahertz large wafer probing; z-profiling function; z-travel; Apertures; Contracts; Q measurement; Reliability; Sensors; Standards; Calibration; measurement uncertainty; probes; sensor control; sensors; submillimeter-wave measurements;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Symposium (IMS), 2014 IEEE MTT-S International

Conference_Location

Tampa, FL

Type

conf

DOI

10.1109/MWSYM.2014.6848623

Filename

6848623