Compact LTCC Yagi-Uda type end-fire antenna-in-package for 60 GHz wireless communications

A compact low-temperature co-fired ceramic (LTCC) antenna-in-package (AiP) solution for 60 GHz mobile wireless application is proposed in this paper. To achieve compact size for mobile applications, the end-fire radiation AiP is designed using the Yagi-Uda antenna concept adding image theory and integrated CMOS chip connected wire-bonding. The LTCC AiP module including the CMOS chip has the size of 3.7 × 5.7 × 0.85 mm³. The measured result of input return loss characteristic is confirmed to be about 9 GHz bandwidth from 57 GHz to 66 GHz using on-chip probing on a FR-4 evaluation board. The 6.2 dBi gain, and over 70 degrees (E, H-plane) half power beam width (HPBW) at 60 GHz are obtained by the 3D EM simulator. The estimated radiation efficiency is about 90 % at 60 GHz.