DocumentCode
1716492
Title
Improving the deflection of wire bonds in stacked chip scale package (CSP)
Author
Yao, Y.F. ; Lin, T.Y. ; Chua, K.H.
Author_Institution
Agere Systems Singapore Pte Ltd.
fYear
2003
Firstpage
1359
Lastpage
1363
Keywords
Bonding; Chip scale packaging; Gold; Integrated circuit packaging; Microassembly; Plasma temperature; Scanning electron microscopy; Shape; Thermal conductivity; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216471
Filename
1216471
Link To Document