Title :
Design optimization of wire bonding for advanced packaging
Author :
Lu, Albert Chee W ; Fan, Wei ; Wai, Lai L. ; Wang, C.K. ; Low, H.G.
Author_Institution :
Singapore Institute of Manufacturing Technology
Keywords :
Bonding; Coplanar waveguides; Design optimization; Electronic components; Frequency; Inductance; Material properties; Packaging; Scattering parameters; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216472
