DocumentCode
1716523
Title
Design optimization of wire bonding for advanced packaging
Author
Lu, Albert Chee W ; Fan, Wei ; Wai, Lai L. ; Wang, C.K. ; Low, H.G.
Author_Institution
Singapore Institute of Manufacturing Technology
fYear
2003
Firstpage
1364
Lastpage
1372
Keywords
Bonding; Coplanar waveguides; Design optimization; Electronic components; Frequency; Inductance; Material properties; Packaging; Scattering parameters; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216472
Filename
1216472
Link To Document