Title :
Effect of void in the anisotropic conductive assembly
Author :
Yeung, N.H. ; Chan, Y.C. ; Tan, S.C. ; Lee, K.K. ; Chan, K.K.
Author_Institution :
City University of Hong Kong
Keywords :
Aluminum; Anisotropic magnetoresistance; Assembly; Bonding; Curing; Finite element methods; Flip chip; Ovens; Stress; Temperature;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216474
