DocumentCode
1716628
Title
A reworkable epoxy resin for isotropically conductive adhesive
Author
Li, Haiying ; Wong, C.P.
Author_Institution
Georgia Institute of Technology
fYear
2003
Firstpage
1391
Lastpage
1397
Keywords
Conducting materials; Conductive adhesives; Epoxy resins; Independent component analysis; Magnetic analysis; Polymers; Rapid thermal processing; Surface resistance; Temperature; Thermal expansion;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216476
Filename
1216476
Link To Document