Title :
A reworkable epoxy resin for isotropically conductive adhesive
Author :
Li, Haiying ; Wong, C.P.
Author_Institution :
Georgia Institute of Technology
Keywords :
Conducting materials; Conductive adhesives; Epoxy resins; Independent component analysis; Magnetic analysis; Polymers; Rapid thermal processing; Surface resistance; Temperature; Thermal expansion;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216476
