DocumentCode
1716652
Title
Flip chip interconnection using anisotropic conductive adhesives for RF and high frequency applications
Author
Yim, Myung-Jin ; Jung, In Ho ; Choi, Hyung-Kyu ; Kim, Kijoong ; Hwang, Jim-Sang ; Ahn, Jin-Yong ; Kwon, Woonseong ; Paik, Kyung Wook
Author_Institution
Telephus, Inc.
fYear
2003
Firstpage
1398
Lastpage
1403
Keywords
Anisotropic magnetoresistance; Assembly; Bonding; Conductive adhesives; Costs; Flip chip; Gold; Integrated circuit interconnections; Packaging; Radio frequency;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216477
Filename
1216477
Link To Document