Title :
Improvements in the reliability and manufacturability of an integrated RF power amplifier module system-in-package, via implementation of conductive epoxy adhesive for selected SMT components
Author :
Cavasin, Daniel ; Brice-Heames, Ken ; Arab, Anwar
Author_Institution :
Motorola Final Manufacturing Operations
Keywords :
Assembly; Bonding; Manufacturing; Power amplifiers; Power system reliability; Radio frequency; Radiofrequency amplifiers; Surface-mount technology; Switches; Wire;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216478
