DocumentCode
1716693
Title
Improvements in the reliability and manufacturability of an integrated RF power amplifier module system-in-package, via implementation of conductive epoxy adhesive for selected SMT components
Author
Cavasin, Daniel ; Brice-Heames, Ken ; Arab, Anwar
Author_Institution
Motorola Final Manufacturing Operations
fYear
2003
Firstpage
1404
Lastpage
1407
Keywords
Assembly; Bonding; Manufacturing; Power amplifiers; Power system reliability; Radio frequency; Radiofrequency amplifiers; Surface-mount technology; Switches; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216478
Filename
1216478
Link To Document