Title :
Next generation pressure sensors in surface micromachining technology
Author :
Lammel, G. ; Armbruster, S. ; Schelling, C. ; Benzel, H. ; Brasas, J. ; Illing, M. ; Gampp, R. ; Senz, V. ; Schäfer, F. ; Finkbeiner, S.
Author_Institution :
Sensor Dev., Robert Bosch GrnbH, Reutlingen, Germany
Abstract :
One of the first MEMS products - the pressure sensor - has still room for innovation. We report a completely new pressure sensor generation based on a novel surface micromachining technology. Using porous silicon the membrane fabrication can be monolithically integrated with high synergy in an analog/digital semiconductor process suited for high volume production in an IC-fabrication facility. Only two mask layers and one electrochemical etching step are inserted at the beginning of a standard IC-process to transform the epitaxial silicon layer from the electronic process into a monocrystalline membrane with a vacuum cavity under it.
Keywords :
etching; membranes; micromachining; microsensors; porous semiconductors; pressure sensors; silicon; IC-process; MEMS; analog/digital semiconductor process; electrochemical etching; epitaxial silicon layer; mask layers; membrane fabrication; monocrystalline membrane; next generation pressure sensors; porous silicon; pressure sensor generation; surface micromachining technology; vacuum cavity; Biomembranes; Bonding; Etching; Fabrication; Glass; Micromachining; Packaging; Resistors; Silicon; Temperature sensors;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on
Print_ISBN :
0-7803-8994-8
DOI :
10.1109/SENSOR.2005.1496352