Title :
Wafer deposition/metallization and back grind, process-induced warpage simulation
Author :
Irving, Scott ; Liu, Yong
Author_Institution :
Fairchild Semiconductor Corporation
Keywords :
Computational modeling; Dielectric materials; Electronic components; History; Internal stresses; Material properties; Metallization; Semiconductor device modeling; Substrates; Temperature;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216487
