DocumentCode
1716922
Title
Cost-performance wafer thinning technology
Author
Wu, Larry ; Chan, Jacky ; Hsiao, C.S.
Author_Institution
Siliconware Precision Industries Co., Ltd.
fYear
2003
Firstpage
1463
Lastpage
1467
Keywords
Cellular phones; Chemical technology; Chip scale packaging; Consumer products; Costs; Economic forecasting; Integrated circuit packaging; Product design; Technology forecasting; Wet etching;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216488
Filename
1216488
Link To Document