Title :
Cost-performance wafer thinning technology
Author :
Wu, Larry ; Chan, Jacky ; Hsiao, C.S.
Author_Institution :
Siliconware Precision Industries Co., Ltd.
Keywords :
Cellular phones; Chemical technology; Chip scale packaging; Consumer products; Costs; Economic forecasting; Integrated circuit packaging; Product design; Technology forecasting; Wet etching;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216488
