Title :
The study on the improvement of lead broken failure in TCP using new Sn pre-plating method
Author :
Son, Dea-Woo ; Lee, Kwan-Jae ; Hwang, Ji-Hwan ; Lee, Si-Hoon ; Chung, Ye-Chung ; Kang, S.Y.
Author_Institution :
Samsung Electronics Co., Ltd
Keywords :
Bonding; Copper; Lead; Manufacturing; Pins; Plastic packaging; Shape; Strontium; Temperature; Tin;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216491
