The study on the improvement of lead broken failure in TCP using new Sn pre-plating method

Author

Son, Dea-Woo ; Lee, Kwan-Jae ; Hwang, Ji-Hwan ; Lee, Si-Hoon ; Chung, Ye-Chung ; Kang, S.Y.

Author_Institution

Samsung Electronics Co., Ltd

fYear

2003

Firstpage

1480

Lastpage

1483

Keywords

Bonding; Copper; Lead; Manufacturing; Pins; Plastic packaging; Shape; Strontium; Temperature; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

DOI

10.1109/ECTC.2003.1216491

Filename

1216491

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