• DocumentCode
    1717034
  • Title

    Development of interconnect technologies for embedded organic packages

  • Author

    Sunohara, Masahiro ; Murayama, Kei ; Higashi, Mitsutoshi ; Shimizu, Mitsuharn

  • Author_Institution
    Shinko Electric Industries Co., LTD.
  • fYear
    2003
  • Firstpage
    1484
  • Lastpage
    1489
  • Keywords
    Capacitors; Components, packaging, and manufacturing technology; Costs; Gold; Insulation; Manufacturing processes; Organic materials; Packaging; Substrates; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216492
  • Filename
    1216492
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1717034