DocumentCode :
1717034
Title :
Development of interconnect technologies for embedded organic packages
Author :
Sunohara, Masahiro ; Murayama, Kei ; Higashi, Mitsutoshi ; Shimizu, Mitsuharn
Author_Institution :
Shinko Electric Industries Co., LTD.
fYear :
2003
Firstpage :
1484
Lastpage :
1489
Keywords :
Capacitors; Components, packaging, and manufacturing technology; Costs; Gold; Insulation; Manufacturing processes; Organic materials; Packaging; Substrates; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN :
0569-5503
Print_ISBN :
0-7803-7791-5
Type :
conf
DOI :
10.1109/ECTC.2003.1216492
Filename :
1216492
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1717034
بازگشت