• DocumentCode
    1717069
  • Title

    Testing and analysing of 256×256 MOS resistor array for IR scene projector

  • Author

    Zhang Kai ; Ma Bin ; Huang Yong ; Sun Li ; Yan Jie

  • Author_Institution
    Coll. of Astronaut., Northwestern Polytech. Univ., Xi´an, China
  • fYear
    2013
  • Firstpage
    143
  • Lastpage
    147
  • Abstract
    The CMOS composite film microbridge-structured resistor array is mainly used for chip design and machining; to our knowledge, there is no detailed report on the analysis of its thermo-electric characteristics and the testing of its performance. Therefore, the paper presented the structure of the chip of the resistor array developed by using semiconductor polycrystalline silicon as its main materials,the microelectronic machining (MEMS) and the anisotropic etching. It also discussed the thermal resistance, thermal conduction, transient response characteristics and emissivity of the composite film microbridge that affect the major performance of a resistor array. Finally it tested its major performances; the test results are in agreement with the thermo-electric characteristics analysis results and show that: (1) the effectiveness of pixels of the 256×256 resistor array reaches over 99.9% and its medium-wave infrared (MWIR) apparent temperature is from 27 to 310°C; (2) with respect to the response characteristics of the resistor array, the time for radiation increase is 4 ms and its time for radiation decrease is 1.6 ms; (3) its high frame rate reaches 200 Hz and its spectral radiation waveband is 2 to 14 μm. The test results verify the correctness and effectiveness of the thermoelectric model and show that the composite film microbridge is suitable for highly dynamic electric to thermal conversion and provides an analysis method and test data for studying the thermoelectric characteristics of a microbridge-structured resistor array, thus having some engineering application values.
  • Keywords
    CMOS integrated circuits; elemental semiconductors; emissivity; etching; heat conduction; integrated circuit design; micromachining; resistors; silicon; spectral analysis; thermal resistance; thermoelectricity; transient response; CMOS composite film microbridge-structured resistor array; IR scene projector; MEMS; MOS resistor array; MWIR apparent temperature; anisotropic etching; chip design; composite film micro bridge emissivity; composite film microbridge; dynamic electric-thermal conversion; high frame rate; medium-wave infrared apparent temperature; microbridge-structured resistor array; microelectronic machining; performance testing; radiation time; resistor array response characteristics; semiconductor polycrystalline; temperature 27 degC to 310 degC; thermal conduction; thermal resistance; thermo-electric characteristics analysis; thermoelectric characteristics; thermoelectric model; transient response characteristics; wavelength 2 mum to 14 mum; Arrays; CMOS integrated circuits; Heating; Machining; Resistors; Thermal conductivity; Thermal resistance; CMOS resistor array; equivalent blackbody temperature; infrared scene simulation; micro-radiator; thermoelectric characteristic;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Communication Technology (ICACT), 2013 15th International Conference on
  • Conference_Location
    PyeongChang
  • ISSN
    1738-9445
  • Print_ISBN
    978-1-4673-3148-7
  • Type

    conf

  • Filename
    6488158