Title :
Development of improved thermal performance embedded heat slug plastic ball grid array package
Author :
Zahn, Bret A. ; Carson, Flynn ; Lee, T.K. ; Coronado, Ray ; Mitchell, Dianne
Author_Institution :
ChipPAC Incorporated
Keywords :
Computational fluid dynamics; Computational modeling; Costs; Electronic packaging thermal management; Electronics packaging; Microelectronics; Performance analysis; Plastic packaging; Software packages; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216493
