DocumentCode
1717076
Title
Development of improved thermal performance embedded heat slug plastic ball grid array package
Author
Zahn, Bret A. ; Carson, Flynn ; Lee, T.K. ; Coronado, Ray ; Mitchell, Dianne
Author_Institution
ChipPAC Incorporated
fYear
2003
Firstpage
1490
Lastpage
1497
Keywords
Computational fluid dynamics; Computational modeling; Costs; Electronic packaging thermal management; Electronics packaging; Microelectronics; Performance analysis; Plastic packaging; Software packages; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216493
Filename
1216493
Link To Document