Title :
New design for high reliability, fillet-less thick film chip resistors
Author :
Kadim, Yaron ; Akhtman, Leonid
Author_Institution :
Vishay Israel Ltd.
Keywords :
Atomic measurements; Conducting materials; Electrodes; Flip chip; Printed circuits; Protection; Resistors; Silver; Substrates; Thick films;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216497