DocumentCode
1717455
Title
Variations in package radiation due to changes in on-die and on-package capacitance
Author
Hill, Michael J. ; He, Jiangqi ; Parmar, Prashant
Author_Institution
Intel Corporation
fYear
2003
Firstpage
1568
Lastpage
1571
Keywords
Capacitance; Clocks; Computational modeling; Electromagnetic compatibility; Electromagnetic interference; Electronics packaging; Frequency; Integrated circuit packaging; Microprocessors; Semiconductor device measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216506
Filename
1216506
Link To Document