Title :
A new efficient equivalent circuit extraction method for multi-port high speed package using multi-input multi-output transmission matrix and polynomial curve fitting
Author :
Lee, Heeseok ; Kiwon Choi ; Jang, Kyoung-Lae ; Cho, Taeje ; Oh, Seyong
Author_Institution :
Samsung Electronics Co., LTD.
Keywords :
Circuit simulation; Curve fitting; Electromagnetic scattering; Electronics packaging; Equivalent circuits; Integrated circuit interconnections; Integrated circuit packaging; Polynomials; RLC circuits; Scattering parameters;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216509
