DocumentCode
1717540
Title
A new efficient equivalent circuit extraction method for multi-port high speed package using multi-input multi-output transmission matrix and polynomial curve fitting
Author
Lee, Heeseok ; Kiwon Choi ; Jang, Kyoung-Lae ; Cho, Taeje ; Oh, Seyong
Author_Institution
Samsung Electronics Co., LTD.
fYear
2003
Firstpage
1582
Lastpage
1588
Keywords
Circuit simulation; Curve fitting; Electromagnetic scattering; Electronics packaging; Equivalent circuits; Integrated circuit interconnections; Integrated circuit packaging; Polynomials; RLC circuits; Scattering parameters;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216509
Filename
1216509
Link To Document