DocumentCode
1717710
Title
Design and electrical characterization of a novel wafer level package for RF MEMS applications
Author
Rotaru, Mihai D. ; Premachandran, C.S. ; Iyer, Mahadevan K.
Author_Institution
Institute of Microelectronics, Singapore
fYear
2003
Firstpage
1626
Lastpage
1630
Keywords
Automotive engineering; Electronics packaging; Integrated circuit interconnections; Microelectromechanical devices; Microelectronics; Protection; Radio frequency; Radiofrequency microelectromechanical systems; Semiconductor device modeling; Wafer scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN
0569-5503
Print_ISBN
0-7803-7791-5
Type
conf
DOI
10.1109/ECTC.2003.1216517
Filename
1216517
Link To Document