Title :
Design and electrical characterization of a novel wafer level package for RF MEMS applications
Author :
Rotaru, Mihai D. ; Premachandran, C.S. ; Iyer, Mahadevan K.
Author_Institution :
Institute of Microelectronics, Singapore
Keywords :
Automotive engineering; Electronics packaging; Integrated circuit interconnections; Microelectromechanical devices; Microelectronics; Protection; Radio frequency; Radiofrequency microelectromechanical systems; Semiconductor device modeling; Wafer scale integration;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216517
