Title :
A method of multi-node thermal network extraction for SPICE compatible simulations
Author :
Shan, Lei ; Kuchta, Daniel ; Young Kwark
Author_Institution :
IBM Corporation
Keywords :
Circuit simulation; Impedance; Laser modes; Optical feedback; Optical sensors; SPICE; Solid modeling; Temperature sensors; Thermal conductivity; Vertical cavity surface emitting lasers;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216518
