Optimization procedure for selection of active components of DC-DC converter´s thermal simulation model

The power electronic system which contains printed circuit board is comprised from set of passive and active components. Active electronic components are represented as source of thermal energy which arises from power loss of given device. By capturing the surface´s temperature of whole electronic system through thermo vision measurement, and by consequent picture analysis of thermo frames, it is possible to identify active components. The aim of this article is development of methodology for optimal selection of mentioned active components for thermal simulation model of given electronic system. The main reason of component minimization is optimization of model´s thermal analysis. That means, the computation of thermal field of investigated system may be accelerated due to lower interactions between active and non active components, whereby pre-defined accuracy of heat transfer shall be achieved.