Title :
Advances in low temperature co-fired ceramic (LTCC) for ever increasing microelectronic applications
Author_Institution :
Kyocera America, Inc.
Keywords :
Ceramics; Conducting materials; Costs; Dielectric materials; Electronics packaging; Manufacturing; Microelectronics; Raw materials; Substrates; Temperature;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216529
