Title :
Microwave curing of anisotropic conductive film: effects of principal parameters on curing situation
Author :
Chan, K.K. ; Yeung, N.H. ; Chan, Y.C. ; Tam, S.C. ; Lee, K.K.
Author_Institution :
City University of Hong Kong
Keywords :
Anisotropic conductive films; Bonding; Curing; Electromagnetic heating; Glass; Integrated circuit interconnections; Microwave ovens; Scanning electron microscopy; Substrates; Temperature;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216531