Title :
Intermittency study of a stressed-metal micro-spring sliding electrical contact
Author :
Chow, Eugene M. ; Klein, Kevin ; Fork, David K. ; Hamschel, T. ; Chua, Christopher L. ; Wong, Lai ; Van Schuylenbergh, Koenraad
Author_Institution :
Palo Alto Research Center (PARC)
Keywords :
Contacts; Gold; Integrated circuit interconnections; Packaging; Soldering; Springs; Substrates; Thermal expansion; Thermal resistance; Voltage;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216533
