• DocumentCode
    1718237
  • Title

    Optimization of stencil printing wafer bumping for fine pitch flip chip applications

  • Author

    Gong, Jig-Feng ; Yau, Esther W C ; Chan, Philip C H ; Lee, Ricky S W ; Yuen, Matthew M F

  • Author_Institution
    The Hong Kong University of Science and Technology
  • fYear
    2003
  • Firstpage
    1724
  • Lastpage
    1730
  • Keywords
    Analysis of variance; Apertures; Assembly; Costs; Electronics packaging; Flip chip; Mechanical engineering; Printing; Signal to noise ratio; Surface-mount technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216535
  • Filename
    1216535
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1718237