Title :
Optimization of stencil printing wafer bumping for fine pitch flip chip applications
Author :
Gong, Jig-Feng ; Yau, Esther W C ; Chan, Philip C H ; Lee, Ricky S W ; Yuen, Matthew M F
Author_Institution :
The Hong Kong University of Science and Technology
Keywords :
Analysis of variance; Apertures; Assembly; Costs; Electronics packaging; Flip chip; Mechanical engineering; Printing; Signal to noise ratio; Surface-mount technology;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216535
