Title :
Analysis of solder joint fracture under mechanical bending test
Author :
Harada, Kozo ; Baba, Shinji ; Wu, Qiang ; Matsushima, Hironori ; Matsunaga, Toshihiro ; Ucgai, Y. ; Kimura, Michitaka
Author_Institution :
Mitsubishi Electric Corp.
Keywords :
Assembly; Bars; Capacitive sensors; Circuit testing; Packaging; Performance evaluation; Research and development; Resins; Soldering; Stress;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216536
