Title :
Investigations of void forming and shear strength of Sn42Bi58 solder joints for low cost applications
Author :
Herzog, Th. ; Wolter, K.-J. ; Poetzsch, F.
Author_Institution :
Dresden University of Technology
Keywords :
Assembly; Chemistry; Costs; Environmentally friendly manufacturing techniques; Lead; Reflow soldering; Resistors; Temperature; Testing; Tin alloys;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216537
