Title :
Crack length analysis of SnPb and SnAg solder joints in plastic ball grid array packages from dye penetration studies
Author :
Kim, Donghyun ; Filho, Jose Marcio Dias ; Park, Changyoung ; Mawer, Andrew ; Moon, Tess J. ; Masada, Glenn Y.
Author_Institution :
The University of Texas at Austin
Keywords :
Aging; Assembly; Capacitive sensors; Creep; Electronic packaging thermal management; Electronics packaging; Plastic packaging; Semiconductor device packaging; Soldering; Thermal expansion;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216538
