Title :
Technique and equipment for rework of flip chips with no flow underfiller
Author :
Kuerbis, Gunter ; Heinze, Roland ; Wolter, Klaus
Author_Institution :
Finetech Berlin
Keywords :
Chemicals; Costs; Curing; Filling; Flip chip; Joining materials; Ovens; Resins; Soldering; Temperature;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216539
