DocumentCode

1718307

Title

Technique and equipment for rework of flip chips with no flow underfiller

Author

Kuerbis, Gunter ; Heinze, Roland ; Wolter, Klaus

Author_Institution

Finetech Berlin

fYear

2003

Firstpage

1754

Lastpage

1760

Keywords

Chemicals; Costs; Curing; Filling; Flip chip; Joining materials; Ovens; Resins; Soldering; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

conf

DOI

10.1109/ECTC.2003.1216539

Filename

1216539