Title :
Characterisation of intermetallic Aging in flip chip solder bumps
Author :
Liu, Changqing ; Li, Dezhi ; Conway, Paul
Author_Institution :
Loughborough University
Keywords :
Aging; Environmentally friendly manufacturing techniques; Flip chip; Gold; Intermetallic; Lead; Microstructure; Nickel; Optical microscopy; Scanning electron microscopy;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216541
