Title :
Analysis of flip-chip packaging challenges on copper low-k interconnects
Author :
Mercado, Lei L. ; Goldberg, Cmdy ; Shun-Meen Koo ; Lee, Tien-Yu Tom ; Pozer, S.
Author_Institution :
Motorola Inc.
Keywords :
Adhesives; Artificial intelligence; Capacitance; Conductivity; Copper; Delay; Dielectric materials; Integrated circuit interconnections; Packaging; Polymer films;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216544
