• DocumentCode
    1718596
  • Title

    Comparison of the adhesion strength of epoxy and silicone based thermal interface materials

  • Author

    Prabhakumar, A. ; Zhong, A. ; Tonapi, Sandeep ; Sherman, D. ; Cole, H. ; Schattenmann, F. ; Srihari, K.

  • Author_Institution
    State University of New York at Bingbarnton
  • fYear
    2003
  • Firstpage
    1809
  • Lastpage
    1814
  • Keywords
    Adhesives; Electric shock; Electronic packaging thermal management; Phase change materials; Silicon; Testing; Thermal conductivity; Thermal management; Thermal management of electronics; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216548
  • Filename
    1216548
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1718596