Title :
Comparison of the adhesion strength of epoxy and silicone based thermal interface materials
Author :
Prabhakumar, A. ; Zhong, A. ; Tonapi, Sandeep ; Sherman, D. ; Cole, H. ; Schattenmann, F. ; Srihari, K.
Author_Institution :
State University of New York at Bingbarnton
Keywords :
Adhesives; Electric shock; Electronic packaging thermal management; Phase change materials; Silicon; Testing; Thermal conductivity; Thermal management; Thermal management of electronics; Thermal resistance;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216548
