Title :
Copper foils for high density IC packages - starting from foil/dielectric adhesion
Author :
Qu, Shichun ; Goffell, R.E. ; Kieschke, Robert R.
Author_Institution :
3M Eau Claire
Keywords :
Adhesives; Bonding; Copper; Dielectrics; Failure analysis; Integrated circuit packaging; Passivation; Resins; Strips; Surface resistance;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216549
