Title :
Lead-free wave soldering development for pcb assembly
Author :
Sunappan, Vasudivan ; Collier, Peter
Author_Institution :
Singapore Institute of Manufacturing Technology
Keywords :
Assembly; Atmosphere; Atmospheric waves; Environmentally friendly manufacturing techniques; Lead; Production; Soldering; Surface resistance; Temperature; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216552
