Title :
Thermal limits in reflow soldering process
Author :
Svasta, Paul ; Simion-Zanescu, Daniel
Author_Institution :
Politchnica University of Bucharest
Keywords :
Assembly; Automatic control; Heat transfer; Infrared heating; Inspection; Ovens; Reflow soldering; Surface treatment; Temperature; Ventilation;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216553
