Title :
Interfacial adhesion analysis of BCB/TiW/Cu/PbSn technology in waferlevel packaging
Author :
Töpper, Michael ; Achen, Albert ; Reichl, Herbert
Author_Institution :
Fraunhofer IZM
Keywords :
Adhesives; Chemicals; Copper; Electronics packaging; Integrated circuit packaging; Metallization; Passivation; Polymers; Semiconductor device measurement; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216554
