• DocumentCode
    1718749
  • Title

    Interfacial adhesion analysis of BCB/TiW/Cu/PbSn technology in waferlevel packaging

  • Author

    Töpper, Michael ; Achen, Albert ; Reichl, Herbert

  • Author_Institution
    Fraunhofer IZM
  • fYear
    2003
  • Firstpage
    1843
  • Lastpage
    1846
  • Keywords
    Adhesives; Chemicals; Copper; Electronics packaging; Integrated circuit packaging; Metallization; Passivation; Polymers; Semiconductor device measurement; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2003. Proceedings. 53rd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7791-5
  • Type

    conf

  • DOI
    10.1109/ECTC.2003.1216554
  • Filename
    1216554
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1718749