DocumentCode :
1718840
Title :
SMT process robustness and board level solder joint reliability of C2BGA
Author :
Zhou, Tiao ; Villa, Claudio M. ; Tee, Tong Yan ; Du, Haibin
Author_Institution :
STMicroelectronics
fYear :
2003
Firstpage :
1869
Lastpage :
1874
Keywords :
Electronic packaging thermal management; Electronics packaging; Environmentally friendly manufacturing techniques; Fatigue; Lead; Materials reliability; Robustness; Soldering; Surface-mount technology; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
ISSN :
0569-5503
Print_ISBN :
0-7803-7791-5
Type :
conf
DOI :
10.1109/ECTC.2003.1216559
Filename :
1216559
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1718840
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