DocumentCode :
171895
Title :
Evaluation of grounding grid´s effective area
Author :
Hanaffi, F. ; Siew, W.H. ; Timoshkin, I. ; Hailiang Lu ; Yu Wang ; Lei Lan ; Xishan Wen
Author_Institution :
Univ. of Strathclyde, Glasgow, UK
fYear :
2014
fDate :
11-18 Oct. 2014
Firstpage :
402
Lastpage :
406
Abstract :
Grounding grid performance when subject to lightning current are different when compared to power frequency environment. Various computer models have been developed to understand transient grounding performance. The models led to the introduction of an “effective area” concept. It is an important concept as the parameter is used to optimize grounding-grid design. Several approaches and numerical equations are proposed by previous researchers to estimate the effective area. Each equation defines the grounding impedance at the injection point. In this paper, transient ground potential rise (TGPR) alongside the grounding grid is used to evaluate the empirical equations proposed by previous researchers. Simulations are based on the electromagnetic approach and the governing equations are solved using the Finite element method (FEM). Different soil resistivity and impulse front times were considered in the simulations.
Keywords :
earthing; finite element analysis; lightning protection; power grids; transient analysis; FEM; TGPR; computer model; effective area concept; electromagnetic approach; empirical equation; finite element method; governing equation; grounding grid effective area evaluation; grounding grid performance; grounding impedance; grounding-grid design; impulse front times; injection point; lightning current; numerical equation; power frequency environment; soil resistivity; transient ground potential rise; transient grounding performance; Analytical models; Atmospheric modeling; Conductivity; Software; Soil; Finite Element Method (FEM); Transients Grounding modelling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Lightning Protection (ICLP), 2014 International Conference o
Conference_Location :
Shanghai
Type :
conf
DOI :
10.1109/ICLP.2014.6973157
Filename :
6973157
Link To Document :
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